Intel Delays Mass Production of 10 nm CPUs to 2019

  1. Brink's Avatar
    Posts : 34,424
    64-bit Windows 10 Pro build 18290
       27 Apr 2018 #1

    Intel Delays Mass Production of 10 nm CPUs to 2019


    Intel on Thursday announced that it would delay mass production of its 10 nm processors from 2018 to 2019 due to yield issues. The company has claimed to be shipping some of its 10 nm chips in small volumes right now, but due to cost reasons the firm does not intend to initiate their high-volume manufacturing (HVM) at this time. Intel executives also stated that they are confident of their product roadmap and intend to launch Whiskey Lake and Cascade Lake products later this year.

    Multipatterning Issues

    Brian Krzanich, CEO of Intel, stated during a conference call with financial analysts:

    “We are shipping [10-nm chips] in low volume and yields are improving, but the rate of improvement is slower than we anticipated. As a result, volume production is moving from the second half of 2018 into 2019. We understand the yield issues and have defined improvements for them, but they will take time to implement and qualify.”

    Intel blames a very high transistor density and consequent heavy use of multipatterning for low yields. Brian Krzanich has said that in certain cases the company needs to use quad (4x), penta (5x), or hexa (6x) patterning for select features as they need to expose the wafer up to six times to “draw” one feature. This not only lengthens Intel’s manufacturing cycle (which by definition rises costs) and the number of masks it uses, but also has an effect on yields.

    Intel’s 10 nm fabrication technology relies solely on deep ultraviolet (DUV) lithography with lasers operating on a 193 nm wavelength at this time. The company’s 7 nm manufacturing process will use extreme ultraviolet (EUV) lithography with laser wavelength of 13.5 nm for select layers, eliminating use of extreme multipatterning for certain metal layers. As it appears, right now Intel executives do not consider EUV technology ready for prime time in 2019, so the company’s engineers have to polish off the last DUV-only process (again) rather than jump straight to 7 nm...


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  2.    27 Apr 2018 #1

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    Tom's Hardware also has article on this
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  3. Cliff S's Avatar
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       27 Apr 2018 #2

    Samsung has been mass producing 10nm since 2016, for SoC chips: https://news.samsung.com/global/sams...fet-technology
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  4.    28 Apr 2018 #3

    AMD says that they are on target for last 1/4 this year.
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  5. Cliff S's Avatar
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       28 Apr 2018 #4

    CountMike said: View Post
    AMD says that they are on target for last 1/4 this year.
    With the 7nm architecture though, isn't it?
    AMD is ahead of Intel this time I believe.

    AMD are splitting 7nm Zen 2 CPU and Vega GPU manufacturing between TSMC and GloFo | PCGamesN
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  6.    28 Apr 2018 #5

    Cliff S said: View Post
    With the 7nm architecture though, isn't it?
    AMD is ahead of Intel this time I believe.

    AMD are splitting 7nm Zen 2 CPU and Vega GPU manufacturing between TSMC and GloFo | PCGamesN
    Yeah, 7 nano-meters. Still wander what will happen when they hit 5nm barrier and how they think to stop leakage.
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  7. Cliff S's Avatar
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       28 Apr 2018 #6

    CountMike said: View Post
    Yeah, 7 nano-meters. Still wander what will happen when they hit 5nm barrier and how they think to stop leakage.
    New material(probably more expensive), or filling with a special gel to slow down/stop electrons, like in nuclear physics(power plants and bombs) used to slow down/control the flow neutrons..
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