Those 2D tests haven't changed for long time now, I was getting better scores with an old Matrox card 10 years ago. But still, just as may benchmark, it's useful for one purpose, to compare results as one makes changes to own system, anything from drivers to overclocking.
Ran across this and thought I should share. I am not using Ryzen, but wanted to add info for you
Ryzen Memory IC Collection Thread
In the OP, they have a link for Thaiphoon Burner, interesting program. I always wondered how I could find out info on my RAM. I thought GSkill RAM was samsung, turns out I have Hynix, it is still good RAM though
Thanks, this goes in my storage too. Prevalent idea is that any memory with Samsung "B" die is preferable and almost guaranteed to work full speed out of the box with Ryzen.
From my research the best compatibility have been found on Samsung B-die Single Rank 2x8GB memory kits.
Worst seems to be from SK Hynix Dual Rank 2x8GB memory kits and Micron 2x8GB memory kits.
This is in current time, I honestly believe as BIOS updates come out we will see some nice changes........
@Dude......yea, Thaiphoon Burner is a handy program......
G.Skill F4-2800C16-4GRK I wouldn't buy this for Ryzen
Prepared by Thaiphoon Burner Super Blaster
-------------------------------------------------------------
MEMORY MODULE
-------------------------------------------------------------
Manufacturer : G.Skill
Part Number : F4-2800C16-4GRK
Serial Number : 00000000
JEDEC DIMM Label : 4GB 1Rx8 PC4-2133P-UA0-10
Architecture : DDR4 SDRAM UDIMM
Speed Grade : DDR4-2133P downbin
Capacity : 4 GB (8 components)
Organization : 512M x64 (1 rank)
Register Manufacturer : N/A
Register Model : N/A
Manufacturing Date : Undefined
Manufacturing Location : Taipei, Taiwan
Revision / Raw Card : 0101h / A0 (8 layers)
-------------------------------------------------------------
DRAM COMPONENTS
-------------------------------------------------------------
Manufacturer : Hynix
Part Number : H5AN4G8NMFR-TFC
Package : Standard Monolithic 78-ball FBGA
Die Density / Count : 4 Gb M-die (29 nm) / 1 die
Composition : 512M x8 (32M x8 x 16 banks)
Clock Frequency : 1067 MHz (0.938 ns)
Minimum Timing Delays : 15-15-15-35-50
Read Latencies Supported : 19T, 18T, 16T, 15T, 14T, 13T, 12T
Supply Voltage : 1.20 V
XMP Certified : 1401 MHz / 16-16-16-36-52 / 1.20 V
XMP Extreme : Not programmed
SPD Revision : 1.0 / January 2014
XMP Revision : 2.0 / December 2013
-------------------------------------------------------------
THERMAL SENSOR
-------------------------------------------------------------
Manufacturer : Giantec
Model : GT34TS04
Revision : 01h
Sensor Status : Enabled
EVENT Output Control : Disabled
Temperature Accuracy : B-Grade
Temperature Resolution : 0.2500°C (10-bit ADC)
Current Temperature : 39.250°C
Negative Measurements : Supported
Interrupt Capability : Supported
OK, MB came in today (Asus x370 Pro), few days earlier than I hoped for. Tomorrow R5 1600x is supposed to be ready to pick up. Time to decide on RAM that's available here. Gonna have to settle for one 8gb module only for now. What oh, what ??? going to chase some now. Maybe I should start with some cheap but 100% compatible one and upgrade later on ?
Some I can afford and best I could find here:
Not much of price difference though and Kingston is always most available brand so it's easiest for me to find another one in a month or so. In local store catalogs they don't even have a filter for 3200 and faster.
Last edited by CountMike; 24 Apr 2017 at 09:06.
I think I would get some 2133 or maybe I should say the least expensive and from the QLV listing for the board for now....
In a month or two there will be a much greater list available to pick from.....
I don't know what to do now, decent 2133MHz is only few bucks cheaper, believe it or not I found one bare 2133 module more expensive than this best one. My worst enemy is my location and poor market choices which are not going to improve soon. Everything else I would have to buy from other EU countries and that's a big bother.
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