Applying thermal paste: best tool to spread it?

Hello:

I'm going to apply fresh thermal compound (Arctic MX-4) to an old Intel Core i7-2760QM 2.40 GHz ("Sandy Bridge", 2nd-Gen quad core mobile CPU). Compared to modern CPU's, this is much smaller.

As per Arctic's recommendations, I will spread the MX-4 in a thin layer to cover the processor. I will also spread on the Nvidia GeForce GT 525M.

This is my first time applying thermal compound. What is better to use as a spreader, a very stiff item like a credit card or a more flexible item like a playing card?

I very carefully use the blunt side of a one sided razor blade.

I don't use any tool, just a blob of suitable size and shape and volume in the centre. It will spread out when the heatsink is applied.

The main point is you need to be scrupulously clean so that no grit gets into the mix. I prefer to use non-conductive compounds for the obvious reason if some is squeezed out.

Spreading it is the worst method, it leaves air bubbles all across the surface.

The best method is, and will always be, a Single Point.

I realize that application method is a long-standing debate. 2GuysTek tested several popular methods and found that the spread method gave the most even application:
You're applying thermal paste wrong! Here's how to do it right! - YouTube

Also, Arctic, who makes the MX-4 compound that I will use, recommends spread method for this processor.

Yes, the most important part is not really the method used, but having the adequate quantity applied...

Thanks for the opinions and info. It's always a risk asking about thermal compound application - it's like a religious war.